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Electronics-and-communication-engineering0
Analog IC Design (View More...)
| Components available in a CMOS process | lec20 | 00:18 to 06:48 | VIDEO | |
| Components available in a CMOS process | lec20 | 06:48 to 10:56 | VIDEO | |
| Components available in a CMOS process | lec20 | 10:56 to 17:51 | VIDEO |
Solid State Devices (View More...)
| Equilibrium and Carrier Concentration (Contdâ¦) | lec10 | 04:37 to 14.23 | VIDEO | |
| Excess Carriers (Contdâ¦) | lec16 | 18:07 to 23:19 | VIDEO | |
| Excess Carriers (Contdâ¦) | lec16 | 48:43 to 51:57 | VIDEO |
MEMS and Microsystems (View More...)
| Micromachining Process | lec11 | 03:03 to 5:34 | VIDEO | |
| Micromachining Process | lec11 | 13:04 to 16:20 | VIDEO | |
| Micromachining Process | lec11 | 37:36 to 40:56 | VIDEO |
VLSI Technology (View More...)
| Oxidation III Dopant Redistribution | lec13 | 40:09 to upto | VIDEO | |
| Oxidation IV Oxide Charges and Oxidation Systems | lec14 | 23:07 to 27:24 | VIDEO | |
| Oxidation IV Oxide Charges and Oxidation Systems | lec14 | 40:19 to upto | VIDEO |
High Speed Devices and Circuits (View More...)
| Metal Semiconductor contacts (contd.) | lec14 | 07:28 to 16:32 | VIDEO | |
| (a) Fermi level pinning (b) I-V Characteristics of Schottky Barrier Diodes | lec16 | 24:09 to 26:06 | VIDEO | |
| (a) Fermi level pinning (b) I-V Characteristics of Schottky Barrier Diodes | lec16 | 31:00 to 32:03 | VIDEO |